We’re pleased to inform you that NSN part number TIBPAL16R8-30MWB is now available in our ready-to-ship inventory. NSN part number TIBPAL16R8-30MWB is a Microcircuit Memory with NSN 5962013325751 and manufactured by Texas Instruments Inc (CAGE Code 01295). We can get you one of the fastest and most competitive quotes on the market for NSN part number TIBPAL16R8-30MWB in just 15 minutes. Are you interested? All you have to do is fill out the Request for Quote (RFQ) provided here.
As you fill out the RFQ, make sure that all fields, especially the asterisk-marked (*) ones like Need Parts By and Quantity (ea), are completely filled out. We will be using your response to these fields in order to understand your requirements and calculate your RFQ accordingly.
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ASAP Supply Chain, owned and operated by ASAP Semiconductor, is a leading distributor of Texas Instruments Inc NSN parts and accessories in the United States. We have an inventory of more than 2 billion parts, new and obsolete, and shipping centers all across the United States, allowing us to get our customers the parts they need as soon as they need them. Our shipping center is located in Anaheim, California.
National Stock Numbers, or NSNs, are 13-digit serials assigned to all items that bought, stocked, and issued via the federal supply chain by the Defense Logistics Agency (DLA). Are you interested in learning more about NSN 5962-01-332-5751 or NSNs in general? Feel free to call us at our toll-free number, +1 (714) 705-4780, or email us at sales@asap-supplychain.com. And for a faster and more convenient purchasing solution, check out the ASAP Semiconductor App on Google Play or the App Store.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-332-5751 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013325751 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 5962-8515506BSX | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAU | BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 0.6 WATTS |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| ABMK | OVERALL WIDTH | 0.745 INCHES MINIMUM AND 1.040 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 0.540 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 12.00 MILLIAMPERES MAXIMUM OUTPUT |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | PAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-9 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | BIPOLAR AND MONOLITHIC AND PROGRAMMABLE AND W/CLOCK AND 3-STATE OUTPUT AND W/ENABLE |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 FLAT LEADS |
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