We’re pleased to inform you that NSN part number MM6306 1J is now available in our ready-to-ship inventory. NSN part number MM6306 1J is a Microcircuit Memory with NSN 5962010399420 and manufactured by Mmi Amd (CAGE Code 50364). We can get you one of the fastest and most competitive quotes on the market for NSN part number MM6306 1J in just 15 minutes. Are you interested? All you have to do is fill out the Request for Quote (RFQ) provided here.
As you fill out the RFQ, make sure that all fields, especially the asterisk-marked (*) ones like Need Parts By and Quantity (ea), are completely filled out. We will be using your response to these fields in order to understand your requirements and calculate your RFQ accordingly.
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ASAP Supply Chain, owned and operated by ASAP Semiconductor, is a leading distributor of Mmi Amd NSN parts and accessories in the United States. We have an inventory of more than 2 billion parts, new and obsolete, and shipping centers all across the United States, allowing us to get our customers the parts they need as soon as they need them. Our shipping center is located in Anaheim, California.
National Stock Numbers, or NSNs, are 13-digit serials assigned to all items that bought, stocked, and issued via the federal supply chain by the Defense Logistics Agency (DLA). Are you interested in learning more about NSN 5962-01-039-9420 or NSNs in general? Feel free to call us at our toll-free number, +1 (714) 705-4780, or email us at sales@asap-supplychain.com. And for a faster and more convenient purchasing solution, check out the ASAP Semiconductor App on Google Play or the App Store.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-039-9420 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 010399420 | N | B | ||
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| B | U | |||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| MM6306-1J | 2 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.750 INCHES MINIMUM AND 0.795 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.120 INCHES MINIMUM AND 0.195 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 625.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | 0.0 TO 75.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | CHEYENNE AIRCRAFT MODEL 427M |
| CBBL | FEATURES PROVIDED | BIPOLAR AND HERMETICALLY SEALED AND HIGH SPEED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND PROGRAMMED AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND W/DISABLE AND W/ENABLE AND W/STORAGE AND 3-STATE OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | -0-001-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 11530-278539 DRAWING THIS IS THE BASIC GOVERNING DRAWING,SUCH AS A CONTRACTOR DRAWING,ORIGINAL EQUIPMENT MANUFACTURER DRAWING,ETC. EXCLUDES ANY SPECIFICATION,STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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