We’re pleased to inform you that NSN part number LTC108FMB25 is now available in our ready-to-ship inventory. NSN part number LTC108FMB25 is a Microcircuit Memory with NSN 5962014435059 and manufactured by Logic Devices Incorporated (CAGE Code 65896). We can get you one of the fastest and most competitive quotes on the market for NSN part number LTC108FMB25 in just 15 minutes. Are you interested? All you have to do is fill out the Request for Quote (RFQ) provided here.
As you fill out the RFQ, make sure that all fields, especially the asterisk-marked (*) ones like Need Parts By and Quantity (ea), are completely filled out. We will be using your response to these fields in order to understand your requirements and calculate your RFQ accordingly.
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ASAP Supply Chain, owned and operated by ASAP Semiconductor, is a leading distributor of Logic Devices Incorporated NSN parts and accessories in the United States. We have an inventory of more than 2 billion parts, new and obsolete, and shipping centers all across the United States, allowing us to get our customers the parts they need as soon as they need them. Our shipping center is located in Anaheim, California.
National Stock Numbers, or NSNs, are 13-digit serials assigned to all items that bought, stocked, and issued via the federal supply chain by the Defense Logistics Agency (DLA). Are you interested in learning more about NSN 5962-01-443-5059 or NSNs in general? Feel free to call us at our toll-free number, +1 (714) 705-4780, or email us at sales@asap-supplychain.com. And for a faster and more convenient purchasing solution, check out the ASAP Semiconductor App on Google Play or the App Store.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-443-5059 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 014435059 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| LTC108FMB25 | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| MRC | Decoded Requirement | Clear Text Reply |
| CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZER | Memory Device Type | RAM |
| CTQX | Current Rating Per Characteristic | 120.00 MILLIAMPERES NOMINAL INPUT |
| CZEQ | Time Rating Per Chacteristic | 85.00 NANOSECONDS NOMINAL ACCESS |
| TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| AFJQ | Storage Temp Range | -65.0 TO 155.0 DEG CELSIUS |
| CQSJ | Inclosure Material | CERAMIC |
| ADAT | Body Width | 0.400 INCHES MINIMUM AND 0.420 INCHES MAXIMUM |
| CWSG | Terminal Surface Treatment | SOLDER |
| CQSZ | Inclosure Configuration | FLAT PACK |
| TTQY | Terminal Type And Quantity | 32 FLAT LEADS |
| ADAQ | Body Length | 0.830 INCHES MAXIMUM |
| AEHX | Maximum Power Dissipation Rating | 1.0 WATTS |
| ADAU | Body Height | 0.125 INCHES MAXIMUM |
| CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS NOMINAL TOTAL SUPPLY |
| AFGA | Operating Temp Range | -55.0 TO 125.0 DEG CELSIUS |
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